General Description
The MTPD007 series piezo-resistive pressure sensor dies are manufactured on six inch silicon wafers
in a class 100 clean room using a state-of-the-art 1.2 micron CMOS facility and are then bulked
micro-machined in a class 1000 clean room. The wafers are batch manufactured using a electrochemical
etch stop process to achieve excellent repeatability.
Applied pressure deforms a diaphragm causing piezo-resisistors to change their resistance. This change
in four resistors, which constitute a wheat stone bridge, results in a pressure-proportional voltage.
Die are probed, inked, diced and visually inspected and shipped on tapes, in rings or in waffle packs.
Dies can be mounted on ceramic or PCB substrates or packaged in application specific packages for
measuring pressure in non-corrosive media.
Features
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Piezo-resistive bridge
Surface passivation
Solid state
High reliability
Optimally sized for application
Low cost design
Suitable for invasive applications
Meet industry specifications
6" wafer availability
100% factory tested
Excellent repeatability
Rated pressure of sensor 0 to 7 psi
Main Fields of Application
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Medical instrumentation
Blood pressure measurement
Infusion pumps
Kidney dialysis machines