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Spark Technology > Products > Memstech > Pressure Sensor Die > MTPD007

MTPD007 - [Memstech]

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General Description

The MTPD007 series piezo-resistive pressure sensor dies are manufactured on six inch silicon wafers in a class 100 clean room using a state-of-the-art 1.2 micron CMOS facility and are then bulked micro-machined in a class 1000 clean room. The wafers are batch manufactured using a electrochemical etch stop process to achieve excellent repeatability.

Applied pressure deforms a diaphragm causing piezo-resisistors to change their resistance. This change in four resistors, which constitute a wheat stone bridge, results in a pressure-proportional voltage.

Die are probed, inked, diced and visually inspected and shipped on tapes, in rings or in waffle packs. Dies can be mounted on ceramic or PCB substrates or packaged in application specific packages for measuring pressure in non-corrosive media.


Features

  • Piezo-resistive bridge
  • Surface passivation
  • Solid state
  • High reliability
  • Optimally sized for application
  • Low cost design
  • Suitable for invasive applications
  • Meet industry specifications
  • 6" wafer availability
  • 100% factory tested
  • Excellent repeatability
  • Rated pressure of sensor 0 to 7 psi

Main Fields of Application

  • Medical instrumentation
  • Blood pressure measurement
  • Infusion pumps
  • Kidney dialysis machines

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